Q: Hi, Mo. Thanks for taking the time today. Please share your vision on extraction products and how the market is driving the direction for extraction products to serve the customer base.
The semiconductor design ecosystem is rapidly evolving with the introduction of 3D devices at advanced nodes, 3DIC technology, and integration of various components on the same die. Co-design at the chip level, and chip-package co-design flows, are gaining prominence. These market drivers dictate the direction for parasitic extraction tools.
StarRC and QuickCap R&D continue to invest and innovate in several important areas. This includes scalable runtime and capacity of our core extraction and field solver technologies, productivity and ease-of-use, and advanced capabilities to support evolving design challenges in growing markets including custom design and 3DIC. We are innovating to support gate-all-around (GAA), vertical FET (VFET), complimentary FET (CFET), and other upcoming 3D device technologies. Our collaboration with foundries and leading design companies is stronger than ever giving us a dominant position as the golden signoff extraction tool.
Our integration with custom and digital platforms has been enhanced in 2020 to provide sign-off accurate extraction and seamless user experience for all of our newly introduced features.. StarRC enjoys a dominant position in the digital design market and our goal is to achieve similar status for the custom design market.