Why Attend?

This year the TSMC Technology Symposium will be hosted in-person on June 22 for North America. TSMC will provide an extensive update on the status of advanced semiconductor and packaging technology development in the Technology Symposium sessions. Join us to learn more on:

  • TSMC's smartphone, HPC, IoT, and automotive platform solutions
  • TSMC's advanced technology progress on 7nm, 6nm, 5nm, 4nm, 3nm processes and beyond
  • TSMC's specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more
  • TSMC's advanced packaging technology advancement on InFO, CoWoS®, and SoIC and other exciting innovations
  • TSMC's manufacturing excellence, capacity expansion plan, and green manufacturing achievement
  • TSMC's Open Innovation Platform® Ecosystem to speed up time-to-design

North America | TSMC Technology Symposium | June 22

Synopsys Booth

TSMC attendees are invited to visit the Synopsys booth to view the latest innovative technologies and chat with Synopsys experts live! 

Booth topics include:

  • DesignWare IP
  • Fusion Design Platform
  • Design Signoff
  • Unlock the Transformative Power of Artificial Intelligence
  • Break Free from Legacy Analog Design Tools
  • Accelerate Physical Verification Closure using IC Validator
  • Silicon Lifecycle Managment Platform
  • Automotive Solutions - Design the future of automotive with Synopsys

Exhibit Hours

North America: June 16, 2021 @ 8:30am -5:05pm PDT

Asia Pacific | Europe | TSMC Technology Symposium