TSMC OIP Ecosystem Forum

Why Attend?

Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges!

Learn About:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies
  • Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications
  • Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration, mmWave RF, and automotive designs targeting automotive and IoT designs
  • Ecosystem-specific TSMC reference flow implementations, P& R optimization, machine learning to improve design quality and productivity, and cloud-based design solutions
  • Successful, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers

North America | Europe | Asia Pacific

Synopsys In-Person Presentations | North America

  • Synopsys / Ansys / Keysight mmWave Reference Design Flow on TSMC N16FFC
  • Achieving Best Performance-per-Watt at TSMC’s N2 and N3E Hybrid-Row Process Technology Nodes using Fusion Compiler and the Fusion Design Platform
  • An Accurate and Low-Cost Flow for Aging-Aware Static Timing Analysis
  • Analog Design Migration Flow from TSMC N5/N4 to N3E with Synopsys Case Study
  • Analysis of Design Timing Effects of Threshold Voltage Mistracking between Cells
  • 3D System Integration and Advanced Packaging for next-generation multi-die system design using Synopsys 3DIC Compiler with TSMC 3DBlox and 3DFabric
  • HPC & Networking Trends Influencing High-Speed SerDes Requirements
  • Achieve 400W Thermal Envelope for AI-Enabled Data Center SoCs - Challenge Accepted
  • Understanding UCIe for Multi-Die Systems Leveraging CoWoS and Substrate Packaging Technologies

Synopsys In-Person & Virtual Booth

<p>TSMC attendees are invited to visit the Synopsys booth to view the latest innovative technologies and chat with Synopsys experts live!&nbsp;</p><p>Booth topics include:</p><ul><li>DesignWare IP</li><li>Fusion Design Platform</li><li>Design Signoff</li><li>Unlock the Transformative Power of Artificial Intelligence</li><li>Break Free from Legacy Analog Design Tools</li><li>Accelerate Physical Verification Closure using IC Validator</li><li>Silicon Lifecycle Managment Platform</li><li>Automotive Solutions - Design the future of automotive with Synopsys</li></ul>

Synopsys Booth

TSMC attendees are invited to visit the Synopsys booth to view the latest innovative technologies and chat with Synopsys experts live! 

Booth topics include:

  • DesignWare IP
  • Fusion Design Platform
  • Design Signoff
  • Unlock the Transformative Power of Artificial Intelligence
  • Break Free from Legacy Analog Design Tools
  • Accelerate Physical Verification Closure using IC Validator
  • Silicon Lifecycle Managment Platform
  • Automotive Solutions - Design the future of automotive with Synopsys