Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges!
- Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies
- Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications
- Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration, mmWave RF, and automotive designs targeting automotive and IoT designs
- Ecosystem-specific TSMC reference flow implementations, P& R optimization, machine learning to improve design quality and productivity, and cloud-based design solutions
- Successful, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers