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Why Attend?
Join the TSMC 2022 Open Innovation Platform Ecosystem Forum and learn from OIP partners how to leverage their technology for your design challenges!
Learn About:
- Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies
- Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications
- Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration, mmWave RF, and automotive designs targeting automotive and IoT designs
- Ecosystem-specific TSMC reference flow implementations, P& R optimization, machine learning to improve design quality and productivity, and cloud-based design solutions
- Successful, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers
North America | Europe | Asia Pacific
Synopsys In-Person Presentations | North America
- Synopsys / Ansys / Keysight mmWave Reference Design Flow on TSMC N16FFC
- Achieving Best Performance-per-Watt at TSMC’s N2 and N3E Hybrid-Row Process Technology Nodes using Fusion Compiler and the Fusion Design Platform
- An Accurate and Low-Cost Flow for Aging-Aware Static Timing Analysis
- Analog Design Migration Flow from TSMC N5/N4 to N3E with Synopsys Case Study
- Analysis of Design Timing Effects of Threshold Voltage Mistracking between Cells
- 3D System Integration and Advanced Packaging for next-generation multi-die system design using Synopsys 3DIC Compiler with TSMC 3DBlox and 3DFabric
- HPC & Networking Trends Influencing High-Speed SerDes Requirements
- Achieve 400W Thermal Envelope for AI-Enabled Data Center SoCs - Challenge Accepted
- Understanding UCIe for Multi-Die Systems Leveraging CoWoS and Substrate Packaging Technologies
Synopsys In-Person & Virtual Booth
Synopsys Booth
TSMC attendees are invited to visit the Synopsys booth to view the latest innovative technologies and chat with Synopsys experts live!
Booth topics include:
- DesignWare IP
- Fusion Design Platform
- Design Signoff
- Unlock the Transformative Power of Artificial Intelligence
- Break Free from Legacy Analog Design Tools
- Accelerate Physical Verification Closure using IC Validator
- Silicon Lifecycle Managment Platform
- Automotive Solutions - Design the future of automotive with Synopsys
