TSMC OIP Ecosystem Forum 2021

North America | Virtual Experience | October 26, 2021

Why Attend?

This year TSMC will be hosting North America, Europe and China customer event virtually, the TSMC Open Innovation Platform Ecosystem Forum on October 26, 2021. TSMC and its ecosystem partners will share the latest collaboration efforts in the TSMC Open Innovation Platform Ecosystem Forum. 

Asia Pacific | Europe

North America | TSMC OIP | October 26

Synopsys Virtual Booth

TSMC attendees are invited to visit the Synopsys booth to view the latest innovative technologies and chat with Synopsys experts live! 

Booth topics include:

  • DesignWare IP
  • Fusion Design Platform
  • Design Signoff
  • Unlock the Transformative Power of Artificial Intelligence
  • Break Free from Legacy Analog Design Tools
  • Accelerate Physical Verification Closure using IC Validator
  • Silicon Lifecycle Managment Platform
  • Automotive Solutions - Design the future of automotive with Synopsys

TSMC 2020 Open Innovation Platform Forum (OIP)

Please visit the following Synopsys presentations at the TSMC OIP Forum:

  • Achieving High-performance 2.5D and 3D Multi-die Silicon Systems on TSMC 3DFabric
  • Best practices to accelerate tapeouts of advanced Arm-based SoCs targeting the latest TSMC technology nodes
  • Developing Microcontrollers & IoT SoCs at 22nm with DesignWare Foundation IP 
  • Enabling Greater Compute Power for HPC SoCs With High-Speed PHY IP on TSMC’s FinFET Processes 
  • Implementation of supply droop monitoring in support of HPC applications targeting TSMC N3 process technologies 
  • Journey to the Best Performance-per-Watt at TSMC’s N3 Process Technology Node using Fusion Compiler and the Fusion Design Platform 
  • 3D Silicon Stacking and Advanced Packaging for High-Performance Computing using TSMC 3DFabric™ and Synopsys’ Integrated 3DIC Design and Signoff Solution