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TCAD Seminar 2023
Join our TCAD Seminar to learn about the application of Synopsys TCAD solutions to accelerate the research, development, and optimization of semiconductor technologies. The seminar tracks cover all major semiconductor technologies, from advanced logic and memory to analog, power electronics and optoelectronics. The solutions presented in this seminar are based on:
- Industry-standard Sentaurus TCAD, Sentaurus Calibration Workbench, and Sentaurus Process Explorer tools
- TCAD integrated into simulation flows that often also include the QuantumATK platform for atomic-scale materials modeling
- TCAD-to-SPICE extraction for links into circuit simulation
- Design Technology Co-Optimization (DTCO)
Who Should Attend?
TCAD engineers, technology development engineers, DTCO technologists, device and process engineers and managers who work in technology development and want to learn the latest techniques for using Synopsys TCAD products.
Register Now
Select your location, hover your mouse over the card and click "Register Now" to access the registration page.
What You Will Learn
The purpose of this seminar is to communicate the latest enhancements in the Synopsys’ TCAD products and their application to the development of state-of-the-art semiconductor technologies. Our aim is to equip attendees with practical techniques to explore new device concepts and to optimize processes to improve device performance and manufacturability. Key topics include solution oriented TCAD simulation flows, materials modeling, calibration methodologies and model selection, 3D process emulation, variability analysis and DTCO of logic, memory, RF, and power electronics.
Topics:
- Industry Expert Invited Talks
- TCAD Overview
- Materials Modeling & Simulation
- Advanced Process and Device
- Calibration & Integration
- Q&A
Agenda
Agenda is subject to modification
| Time | Duration | Topics | Details | Presenters |
| 8:30 ~ 9:00 | 30 mins | Registration | ||
| 9:00 ~ 9:30 | 15 mins | Welcome | • Corporate Update | Mark Han, VP, Engineering |
| 15 mins | TCAD Overview | • Overview of Industry and TCAD Trends | Shela Aboud, Technical Product Mgmt, Sr Staff, Synopsys |
|
| • TCAD Roadmap | ||||
| 9:30 ~ 10:15 | 45 mins | Materials Modeling and Simulation | • New Features | Ronald Gull, Group Director, R&D, Synopsys |
| • Application Examples: Memory, Logic, Power | ||||
| • M/L Based Modeling: MTP | ||||
| 10:15 ~10:30 | 15 mins | Break | ||
| 10:30 ~ 11:00 | 30 mins | Invited Talk | • TCAD Augmented Generative Adversarial Network for Hot-Spot Detection and Mask-Layout Optimization | Dr. Hyoung Cheol Kwon, SK Hynix |
| 11:00 ~ 12:00 | 60 mins | Advanced Process and Device | • Topography: Advanced Etching and Deposition | Karim El Sayed, Group Director, Application Engineering, Synopsys |
| • Mechanical Analysis: Device to Wafer Level Analysis | ||||
| • Advanced Modeling for Power and CIS | ||||
| 12:00 ~ 13:00 | 60 mins | Lunch | ||
| 13:00 ~ 13:30 | 30 mins | Invited Talk | • Ferroelectric Transistor-Based Content-Addressable Memory | Prof. Woo Young Choi, Seoul National University |
| 13:30 ~ 14:15 | 45 mins | Calibration | • SCW Topics | Ronald Gull, Group Director, R&D, Synopsys |
| 14:15 ~ 14:30 | 15 mins | Break | ||
| 14:30 ~ 15:30 | 60 mins | Integration | • Advanced Example for Sub 1nm Technology | Xi-Wei Lin, Director, Application Engineering, Synopsys |
| • Process Explorer for Integration | ||||
| • DTCO | ||||
| 15:30 ~ 16:00 | 30 mins | Q&A | All Presenters | |
| Time | Duration | Topics | Details | Speaker |
| 8:30 ~9:00 | 30 mins | Check in & Networking | ||
| 9:00 ~ 9:15 | 15 mins | Welcome | • Corporate Update | Aveek Sarkar, VP, Engineering, Synopsys |
| 9:15 ~ 9:45 | 30 mins | Invited Talk | • New Frontiers in the Semiconductor Universe | Dr. Jack Sun (孫元成博士), Dean & Chair Professor of Industry Academia Innovation School, NYCU |
| 9:45 ~ 10:00 | 15 mins | TCAD Overview | • Overview of Industry and TCAD Trends | Shela Aboud, Technical Product Mgmt, Sr Staff, Synopsys |
| • TCAD Roadmap | ||||
| 10:00 ~ 10:15 | 15 mins | Break | ||
| 10:15 ~ 11:00 | 45 mins | Materials Modeling and Simulation | • New Features | Ronald Gull, Group Director, R&D, Synopsys |
| • Application Examples: Memory, Logic, Power | ||||
| • M/L Based Modeling: MTP | ||||
| 11:00 ~ 12:00 | 60 mins | Advanced Process and Device | • Topography: Advanced Etching and Deposition | Karim El Sayed, Group Director, Application Engineering, Synopsys |
| • Mechanical Analysis: Device to Wafer Level Analysis. | ||||
| • Advanced Modeling for Power and CIS | ||||
| 12:00 ~ 13:30 | 90 mins | LUNCH | ||
| 13:30 ~14:00 | 30 mins | Invited Talk | • Developing Physics-Based TCAD Model for AlGaN/GaN Power HEMTS | Dr. Jerry Lin (林志鴻博士), TCAD Deputy Manager, Vanguard International Semiconductor (VIS) |
| 14:00 ~ 14:45 | 45 mins | Calibration | • SCW Engagement in Specialty Areas | Ronald Gull, Group Director, R&D, Synopsys |
| 14:45 ~ 15:00 | 15 mins | Break | ||
| 15:00 ~ 15:45 | 45 mins | Integration | • Advanced Example for Sub 1nm Technology | Xi-Wei Lin, Director, Application Engineering, Synopsys |
| • Process Explorer for Integration | ||||
| 15:45 ~ 16:15 | 30 mins | Power Devices | • Power Devices Developments | Karim El Sayed, Group Director, Application Engineering, Synopsys |
| 16:15 ~ 16:30 | 15 mins | Wrap-up, Q&A, Luck Draw & Survey | All Presenters | |
| Time | Duration | Topics | Speaker |
| 12:30 | Open | ||
| 13:00 | 00:20 | Opening Message/Synopsys business summary | Tomoyuki Kawarai, President, Japan Synopsys LLC |
| 13:20 | 00:30 | Technical Presentation 1: Semiconductor WW market and business trend 1) Power Device 2) Memory and Logic 3) Sensor |
Shela Aboud, Technical Product Mgmt, Sr Staff, Synopsys |
| 13:50 | 00:10 | Break | |
| 14:00 | 00:40 | User Presentation#1 (Silicon Power Device) Design of 1200 V RC IGBT for TOYOTA s 5th Generation HEV/PHEV Systems |
Yusuke Yamashita, Researcher, Toyota Central R&D Lab.Inc. |
| 14:40 | 00:20 | Technical Presentation 2: Introduction of state-of-the-art TCAD technology: DTCO | Ricardo Borges, Director, Product Line Mgt |
| 15:00 | 00:20 | Technical Presentation 3: Introduction of state-of-the-art TCAD technology: SCW | Ronald Gull, Group Director, R&D, Synopsys |
| 15:20 | 00:20 | Break | |
| 15:40 | 00:40 | User Presentation#2 (SiC Power Device) Performance and reliability improvement in SBD-embedded SiC-MOSFETs |
Hiroshi Kono, Manager, Toshiba Electronic Devices & Storage Corp. |
| 16:20 | 00:30 | Technical Presentation 3: Sentaurus TCAD update and development roadmap 1) V-2023.09 Update Highlight 2) TAT improvement 3) Development Roadmap |
Karim El Sayed, Group Director, Application Engineering, Synopsys |
| 16:50 | 00:40 | User Presentation#3 (Package) TCAD Simulation Modeling of Mold Epoxy Resin as Encapsulation Material in Power Devices |
Tomohiro Tamaki, Mitsubishi Electric Corp. |
| 17:30 | 00:10 | Session Close/Move | |
| 17:40 | 01:30 | Banquet | |
| 19:10 | Close |