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What is the DARPA ERI 2.0 Summit?
The Electronics Resurgence Initiative (ERI), DARPA’s response to the United States’ microelectronics (ME) concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development, and manufacturing.
DARPA expanded ERI’s focus with the announcement of ERI 2.0 with 3D Heterogenous Integration (3DHI) and extreme environment design and operation, which seeks to reinvent the domestic microelectronics development and supply chains. The original ERI focused on security, electronics design costs, revolutionizing communications, overcoming the limits of 2D electronics, accelerating innovation in AI hardware, and increasing processing density and efficiency. ERI 2.0 is expected to strengthen DARPA’s leadership in driving the next generation of microelectronics for national security by creating a national capability for 3DHI manufacturing, focused research in manufacturing complex 3D ME systems, and developing electronics for extreme environments.
Who Should Attend?
This event provides an opportunity for government researchers, defense prime contractors, defense suppliers, national laboratories, industry leaders and academia to mix and see presentations on the latest technologies and products. This is a must-attend event for engineers, scientists and managers who are interested in innovation, security, resilience, safety, and reliability.
Synopsys at DARPA ERI 2.0 Summit
Synopsys solutions enables aerospace and defense companies to build and deploy advanced systems that exceed mission requirements and address challenging application demands, including security, safety, longevity and reliability in harsh environments with low size, weight and power (SWaP) from sea to space. Synopsys is a US DoD trusted design service supplier through our subsidiary FirstPass Engineering. We look forward to meeting with you at the event!
Customer Meetings
Let's have a conversation
Interested in how Synopsys works with government, aerospace and defense industry leaders? Schedule a meeting at DARPA ERI 2.0 so we can answer your questions and investigate how we might work together, including how Synopsys can help you differentiate while exceeding system and mission requirements.
Partners
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Partners
Design for a Range of Challenging Environments,
The combined Synopsys-Ansys flows enable aerospace and defense customers to do early analysis for 3DIC, digital design, and AMS design that identify the optimal architecture to operate in a specific environment or a range of environments.
Synopsys Highlights at DARPA ERI
Dr. Rob Aitken
Distinguished Architect
Synopsys
Session: 3DIC EDA: What Is Needed, and How/When Can We Deliver?
Synopsys Lightning Talk: Latest Results and Upcoming Challenges in Architecture Synthesis for 3D ICs
Tuesday, August 22, 2023
1:20 p.m. – 2:20 p.m. PT
Architecting a multi-die system is more than designing a set of chiplets and connecting them together. Compute hardware, software and memory systems need to work together efficiently while remaining within their power and thermal constraints. Design automation can help guide architecture exploration, connectivity and design partitioning, leading to optimized chiplet implementation. AI technology provides additional improvements beyond what can be achieved with standard approaches.
Poster: Reimagining Hardware Security Design for Systems-on-Chip (SoC)
Wednesday, August 23, 2023
4:30 p.m. – 5:30 p.m. PT
The impressive results of the AISS (Automatic Implementation of Secure Silicon) program will be featured, including those achieved by using AI techniques to rapidly determine an optimal system configuration meeting power, performance, area, and security design constraints. The poster illustrates the significant productivity of design targets this technology provides as well as the embedded knowledge that helps to Democratize Secure Silicon for users.
Dale Donchin
Senior Program Manager
Synopsys
Jian Yang
Technical Product Mgmt Director
Synopsys
Workshop: Revolutionizing RF/mmWave Design Automation Through Development and Application of Artificial Intelligence and Machine Learning Tools
Thursday, August 24, 2023
08:30 a.m. – 03:30 p.m. PT
Room: Elwha A - 5th Floor
Synopsys Presentation: A Commercial Perspective on AI/ML Enabled RF/mmWave IC Designs
10:15 a.m. – 10:30 a.m. PT
AI/ML opens up new possibilities for RF/mmWave IC designs:
- Explore design spaces that are outside the human intuition
- Improve synthesis speed, reducing labor and time
- Rapidly migrate across foundry technology nodes and PDKs
Deep learning can model complex electromagnetic (EM) structures and eliminate time-consuming EM synthesis and optimization. Reinforcement learning can also be used for rapid design and layout of analog and mixed-signal blocks. This talk provides a commercial perspective of leveraging Synopsys.ai for RF/mmWave IC designs.
