Arm Videos

Arm TechCon 2017: Achieving Maximum MHz/mW on Kirin 970 Mobile AI Computing SoC Using Synopsys Design Platform

As Arm accelerates the introduction of new processor IP that serves the needs of an expanding market place, designers are embracing the performance/power and throughput advantages promised by these new processors and maximizing them by fabricating in the most advanced silicon process technology.

Leah Shuth, Technical Marketing Director, Arm and Michael Montana, Principal Engineer, Synopsys

Arm TechCon 2017: Enabling Superior PPA on Arm’s Next-generation Processors Using Synopsys Design Platform

HiSilicon Technologies shares best practices to accelerate the achievement of maximum megahertz per milliwatt on their Kirin 970 Arm® core-based mobile AI computing SoC using the Synopsys Design Platform.

Shuiqing Liao, COT Project Manager, HiSilicon and Muming Tang, AE Manager, Synopsys

Arm TechCon 2016: HiSilicon Achieving Maximum Megahertz per Milliwatt on the Arm Cortex-A73 Processor Using Synopsys Design Platform

View this video from Arm TechCon 2016 to see an overview of the Arm, Synopsys and HiSilicon partnership and its recent successes. You will learn how we’re working together to enable technologies that allow customers like HiSilicon to realize maximum GHz/mW on their leading-edge designs. In addition, HiSilicon discusses their successful application of Synopsys' high-performance flow in the tapeout of Arm's latest processor, Arm® Cortex®- A73, in TSMC’s 16nm FinFET Plus process technology.

Arm and Synopsys: Collaborating to Enable Advanced Design

In this short video, Dipesh Patel, EVP of Incubation Businesses at Arm, highlights three Arm-Synopsys collaboration areas to enable our mutual customers create Arm-based products.


“At SNUG, through deep technical presentations and interaction with all the attendees, you get insights into real design challenges and real solutions.”