Guest Speakers and Bios
Ed Sperling (Moderator)
Editor in Chief, Semiconductor Engineering
Ed Sperling is the editor in chief of Semiconductor Engineering. He is a technology industry veteran and frequent moderator and speaker based in Silicon Valley. Sperling is a former contributing editor at Forbes, the former editor in chief of Electronic News and Electronic Business, and he has held top editorial positions at Ziff-Davis and CMP Publications.
VP of IoT, GLOBALFOUNDRIES
Rajeev Rajan is Vice President of Internet of Things (IoT) at GLOBALFOUNDRIES, responsible for driving thought leadership and strategic direction for IoT, Automotive, and New Markets’ applications spanning devices to data centers.
Prior to joining GLOBALFOUNDRIES, Rajeev was Sr. Director, Product Management and Marketing at Qualcomm Life Inc. Previously, he was co-founder and CTO of 2net™, a digital health start-up, which has become the multi-million dollar Qualcomm healthcare company. He holds more than 40 patents and is a co-author of the book Wireless Health: Remaking of Medicine by Pervasive Technologies.
Director of Product Development, IoT Solutions Group, AT&T
Steve Hardin has over 25 years of experience in the wireless industry and presently leads the AT&T team which interfaces with connected device and module vendors for "Network Ready" certification on the AT&T wireless network. Steve also develops network capabilities for AT&T, supporting the emerging devices organization. Previously, Steve was a Director in the Chief Technology Officer's organization of AT&T and Cingular Wireless where he oversaw network projects such as Visual Voicemail, 411 DA, Push-To-Talk, Femtocell, Location Based Services, E-911, CALEA, and Mobile Convergence solutions. Prior to the formation of Cingular Wireless Steve managed the wireless device certification team for BellSouth Cellular Corporation.
Dr. Wayne Wei-Ming Dai is the founder, President, and CEO of VeriSilicon. Prior to VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc. Prior to that, he was the founder and CEO of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.
Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and the founding Chairman of IEEE Symposium on IC/Package Design Integration. He has published over 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was elected as one the top ten venture-backed entrepreneurs in China in 2005, and elected as one of the 2005 top ten talents of science and technology in China. In 2007, he was recognized as The Ernst & Young Entrepreneur of the Year in China. In 2013, he was honored as The Executive of the Year of 2013 ACE Award. In 2014, he was awarded "Hurun Industry Achievement Award 2014".
Wayne Dai received his B. A. degree in Computer Science and his Ph. D. degree in Electrical Engineering, both from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.
VP of Solutions Group, Synopsys
John Koeter joined Synopsys in 1998 and is currently Vice President of Marketing for the Solutions Group. In that capacity, he is responsible for the marketing of Synopsys' DesignWare® IP, prototyping and FPGA design products. Before coming to Synopsys, Mr. Koeter held marketing, engineering, and corporate application engineering positions with Texas Instruments and Advanced Micro Devices. Mr. Koeter holds a BSEE degree from Cornell University.