Synopsys-Arm Tech Collaborations Track at Arm TechCon 2017

armtechon 2017 forum

In the videos below, recorded at the Synopsys Forum at Synopsys-Arm Collaborations Track at Arm TechCon 2017, design experts from Arm, HiSilicon and Synopsys discuss their latest innovations and successes using the Synopsys Design Platform.

Achieving Maximum MHz/mW on Kirin 970 Mobile AI Computing SoC Using Synopsys Design Platform

As Arm accelerates the introduction of new processor IP that serves the needs of an expanding market place, designers are embracing the performance/power and throughput advantages promised by these new processors and maximizing them by fabricating in the most advanced silicon process technology.

Leah Shuth, Technical Marketing Director, Arm and Michael Montana, Principal Engineer, Synopsys

HiSilicon Success Story: Enabling Superior PPA on Arm’s Next-generation Processors Using Synopsys Design Platform

HiSilicon Technologies shares best practices to accelerate the achievement of maximum megahertz per milliwatt on their Kirin 970 Arm® core-based mobile AI computing SoC using the Synopsys Design Platform.

Shuiqing Liao, COT Project Manager, HiSilicon and Muming Tang, AE Manager, Synopsys