A Silicon Interposer-based 2.5D-IC Design Flow, Going 3D by Evolution Rather Than by Revolution
Dr. Michael Jackson, VP of R&D and Physical Implementation at Synopsys ponders the 3D-IC technology trends, their timeline, and the impact on EDA, proposing that a silicon interposer-based 2.5D-IC design flow is well within our reach.
Mar 24, 2012
Three-dimensional integrated circuit (3D-IC) systems offer the potential to deliver significant improvements in performance, power, functional density, and form factor over other packaging integration techniques. This article focuses on the test challenges and solutions, highlighting a design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute (ITRI) based on the Synopsys test solution.
Jan 16, 2012