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A Low Power Open Multimedia Application Platform for 3G Wireless
Abstract
This paper describes a systems-on-chip (SoC) design of a complex, ultra-low power and high performance open multimedia application platform for 2.5/3G wireless. The design integrates a high performance DSP core based on an ultra-low power TMS320C55x DSP and a MPU core based on the ARMŽ9 Microprocessor for the optimal combination of high performance with low power consumption. The system design and the SoC implementations of the platform are described in this paper.
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