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| HELPING YOU DESIGN THE CHIP INSIDE |
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Back to TCAD Home
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| Contributed Articles |
- Semiconductor International, Nov 2007: Strain Engineering and Layout Context Variability at 45 nm
- Electronic Products, June 2007: Simulation technique for optimizing white-LED design
- Future Fab, July 2007: Managing Process Variability in Advanced CMOS Technologies
- Compound Semiconductor Magazine, July 2006: Simulations provide additional insights into GaN HFET reliability - PDF
- Photonics Tech Brief, July 2006: DFM Your Device? Simulation is the Answer - PDF
- Semiconductor Manufacturing, December 2005: Bringing Manufacturing Into Design Through TCAD - PDF
- Semiconductor International, June 2005: DFM: Worlds Collide, then Cooperate - PDF
- Micro Magazine, June 2005: LITHOGRAPHY: Can’t we all just get along? Designers and manufacturers grapple with DFM - PDF
- Solid State Technology, July Issue: Options at the 45nm node include engineered substrates - PDF
- EE Times, April 2005: What Designers need to know about TCAD? - PDF
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| Lithography Simulation Articles (former SIGMA-C) |
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