Creating 3D Specific Systems
3D stacking and integration with TSVs can provide significant system advantages in terms of power, scale, cost and performance. This talk will cover what we have learned at NCSU over the past five years putting together CAD flows for 3DIC design and designing multiple 3DIC chips in the Lincoln Labs and Tezzaron 3D processes. Issues to be covered in detail include 3D motivation, system engineering, floorplanning and partitioning, thermal analaysis and CAD flow.
Prof. Paul Franzon, North Carolina State University