White Papers 

Test Automation of 3D Integrated Systems
Advances in packaging technologies have led to the development of three-dimensional (3D) integrated systems that offer the potential to deliver significant improvements in performance, power, functional density, and form factor over systems that rely on standard packaging integration techniques. This whitepaper discusses some of the key test challenges related to 3D integrated systems, and how Synopsys’ synthesis-based test solution can be used to rapidly address these challenges.
Chris Allsup, Marketing Manager, Synopsys, Inc.