|Micron Case Study: Electrical Modeling of 3D-IC Through-Silicon Vias Using HSPICE|
Learn how to effectively model the impact of TSVs on signal and power delivery, especially for high-speed applications.
Fuad Badrieh, Ph.D., Principal Engineer, Micron Technology; Hany Elhak, Product Marketing Manager, Synopsys
Jul 10, 2013
|Enabling 3D-IC Integration|
Hear how Xilinx is using SSI technology to deliver higher levels of integration and flexibility in FPGA products, and learn how Synopsys' silicon-proven tools are enabling 3D-IC integration.
Steve Smith, Senior Director, 3D-IC Strategy and Marketing, Synopsys; Shankar Lakka, Director of IC Design, Full-Chip FPGA Integration Group, Xilinx
Jul 18, 2012