Enabling 3D-IC Integration
Hear how Xilinx is using SSI technology to deliver higher levels of integration and flexibility in FPGA products, and learn how Synopsys' silicon-proven tools are enabling 3D-IC integration.
Steve Smith, Senior Director, 3D-IC Strategy and Marketing, Synopsys; Shankar Lakka, Director of IC Design, Full-Chip FPGA Integration Group, Xilinx
Jul 18, 2012 |