White Papers 

Test Automation of 3D Integrated Systems
Advances in packaging technologies have led to the development of three-dimensional (3D) integrated systems that offer the potential to deliver significant improvements in performance, power, functional density, and form factor over systems that rely on standard packaging integration techniques. This whitepaper discusses some of the key test challenges related to 3D integrated systems, and how Synopsys’ synthesis-based test solution can be used to rapidly address these challenges.
Chris Allsup, Marketing Manager, Synopsys, Inc.

Process and Device Simulations of Trench Capacitor Embedded 70nm DRAM
DRAM process technology has been on the leading edge of semiconductor technology, with the density of DRAM quadrupling every three years. As the design rule of DRAM shrinks to sub-80nm, data retention time, cell-capacitance, and parasitic capacitance become the primary factors that determine device performance. At these shrinking dimensions, genuine 3D effects become more pronounced. The strong 3D capabilities of TCAD Sentaurus enable engineers to investigate 3D effects using simulations.
Synopsys, Inc.