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Jun 24, 2013Synopsys Collaborates with A*STAR IME to Optimize TSI Technology
Synopsys Brings its Expertise in 3D-IC Solutions to Singapore’s A*STAR IME-Led 2.5D Through-Silicon Interposer Consortium

Oct 11, 2012Synopsys and TSMC Deliver 3D-IC Design Support
Design Tools Selected in TSMC's First Integrated, Validated Reference Flow and Design Kit Enabling Multi-Die Integration Using TSMC CoWoS Technology

Mar 26, 2012Synopsys Unveils 3D-IC Initiative
Comprehensive EDA Solution Enables Design of Stacked Multi-die Systems Using TSV and Silicon Interposer Technologies

Mar 15, 2012Imec and Synopsys Collaborate on 3D Stacked IC Development
Synopsys TCAD Tools Accelerate Development of Through-Silicon Via Technology