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All Synopsys News
Oct 11, 2012
Synopsys and TSMC Deliver 3D-IC Design Support
Design Tools Selected in TSMC's First Integrated, Validated Reference Flow and Design Kit Enabling Multi-Die Integration Using TSMC CoWoS Technology
Mar 26, 2012
Synopsys Unveils 3D-IC Initiative
Comprehensive EDA Solution Enables Design of Stacked Multi-die Systems Using TSV and Silicon Interposer Technologies
Mar 15, 2012
Imec and Synopsys Collaborate on 3D Stacked IC Development
Synopsys TCAD Tools Accelerate Development of Through-Silicon Via Technology
3D-IC WEBINAR
Enabling 3D-IC Integration
featuring Synopsys and Xilinx
3D-IC PANEL AT DATE
Will 3D-IC Remain a Technology
of the Future…Even in the Future?
Find out 21 March 2013 at DATE
3D-IC VIDEO
Michael Jackson introduces Synopsys’ 3D-IC initiative
3D-IC TEST WHITEPAPER
Test Automation of 3D Integrated Systems
New 3D-IC Initiative
Synopsys unveils 3D-IC initiative to accelerate design of stacked multi-die silicon systems using 3D-IC integration
News
Synopsys and TSMC Deliver 3D-IC Design Support
Synopsys Unveils 3D-IC Initiative
Imec and Synopsys Collaborate on 3D Stacked IC Development
More
All Synopsys News
Articles
The Sky Isn’t Falling
A Silicon Interposer-based 2.5D-IC Design Flow, Going 3D by Evolution Rather than by Revolution
The Fast Track to 3D-IC Testing
Synopsys Debuts DesignWare STAR ECC IP
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White Papers
Test Automation of 3D Integrated Systems
Process and Device Simulations of Trench Capacitor Embedded 70nm DRAM
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Webinars
Enabling 3D-IC Integration
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Videos
Synopsys Unveils 3D-IC Initiative
Introduction to New 2011.09 Test Automation Features
Antun Domic Introduces StarRC Custom
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Newsletters
Synopsys Insight, Issue 1 - 2012
TCAD Newsletter, Sept. 2011
TCAD Newsletter, Sept. 2009
Synopsys Insight, Issue 4 - 2009
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3D-IC FAQs
3D-IC INITIATIVE LAUNCH
Galaxy Platform
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