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How to Use ECC to Protect Embedded Memories
May 23, 2013
Chip Design: Integrating sensor data acquisition in mobile applications
May 20, 2013
Electronic Design: The MIPI M-PHY Reduces Power In Mobile Chip-To-Chip Interfaces
May 06, 2013
SemiWiki: How to protect my wallet against hackers? NVM IP solutions...
Apr 29, 2013
ChipEstimate.com: The Use of FinFETs in IP Design
Apr 23, 2013
EDN: Using audio codecs IP as the digital audio hub in mobile multimedia systems
Apr 23, 2013
Chip Design: The Accelerating Demand for 10 Gbps SuperSpeed USB 3.0
Apr 15, 2013
Electronic Design: JEDEC UFS Streamlines Storage Interface Development
Apr 09, 2013
Insight: ARC EM Starter Kit Accelerates Embedded Software Development
Mar 28, 2013
Insight: Embedded Memory Test & Repair at 20-nm Nodes and Below
Mar 28, 2013
Chip Design: Mitigating RFID/NFC Cost & Power Challenges
Mar 27, 2013
Tech Design Forum: Early shift to finFET processes challenges IP development strategies
Mar 20, 2013
Chip Design: Tomorrow's Semiconductor IP - Not Business as Usual
Mar 08, 2013
New Electronics: Building an IP-XACT design and verification environment with DesignWare IP
Feb 12, 2013
ChipEstimate.com: Interfacing to sensors using Data Converter IP
Feb 05, 2013
EELife: USB 3.0 makes itself right at home
Jan 31, 2013
EETimes Memory DesignLine: Integrating Large-Capacity Memory in Advanced-Node SoCs
Jan 15, 2013
Insight: The Past, Present and Future of DDR4 Memory Interfaces
Dec 06, 2012
Insight: Complete Audio Solutions with ARC Processors
Dec 06, 2012
ChipEstimate.com: High-Performance Logic Libraries for Core Hardening
Dec 04, 2012
EETimes Planet Analog: Debunking Myths About Analog IP at 28-nm
Dec 03, 2012
EETimes Automotive DesignLine: Leverage video for auto electronics design
Oct 29, 2012
IEEE Transactions on Circuits and Systems: Comparator Metastability in the Presence of Noise
Oct 26, 2012
ChipEstimate.com: Reducing Power Consumption in PCI Express-based Devices
Oct 25, 2012
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How to Use ECC to Protect Embedded Memories
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Integrating sensor data acquisition in mobile applications
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Articles
How to Use ECC to Protect Embedded Memories
Chip Design: Integrating sensor data acquisition in mobile applications
Electronic Design: The MIPI M-PHY Reduces Power In Mobile Chip-To-Chip Interfaces
SemiWiki: How to protect my wallet against hackers? NVM IP solutions...
ChipEstimate.com: The Use of FinFETs in IP Design
EDN: Using audio codecs IP as the digital audio hub in mobile multimedia systems
Chip Design: The Accelerating Demand for 10 Gbps SuperSpeed USB 3.0
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USB IP Blog: To USB or Not to USB
The Eyes Have it: A Mixed-Signal IP Blog
On the Move: MIPI IP Blog
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FinFET Technology – Understanding and Productizing a New Transistor From TSMC and Synopsys
From Design to Test: Developing High-Reliability MTP NVM
Synopsys DesignWare ARC EM Family: Efficient CPU Cores for Embedded Applications
Obfuscating Attacks on Secure SoCs through Encrypted Code Execution
Twelve Design Techniques for Successful Integration of Data Converter IP into an SoC
Designing with FinFETs: The Opportunities and the Challenges
Mixed-Signal IP Design Challenges in 28-nm Process and Beyond
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3 Easy Ways to Accelerate Embedded SoC Development
Achieving Highly Reliable 10G Backplane Designs
Ethernet QoS for use in Automotive Networking Designs
Integrating Audio Functionality into SoCs (Mandarin)
Logic Libraries for High-Performance SoCs
Designing with FinFETs
New PCI Express 3.0 Equalization Requirements
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Featured USB Video: Demonstration of USB 3.0 SSIC Compliance Testing with MIPI M-PHY
Featured Ethernet Video: Equalization: Manual or Adaptive
Featured PCIe Video: Minimize High-Speed PHY Risk for First Silicon Success
Featured MIPI Video: Demo of Interop with UFS Host and MIPI UniPro IP
Featured DDR Video: Synopsys Discusses its New DDR4 Memory Interface IP
Featured HDMI Video: Synopsys Demonstrates DesignWare® HDMI Receiver IP Solution with Fast Switching
Featured SATA Video: SATA Host IP Demo Using a Port Multiplier and FIS-Based Switching
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Fujitsu Semiconductor Selects DesignWare DigRFv4 M-PHY and DigRF 3G PHY IP for 2G/3G/4G Baseband Design
Case Study: InfoTM Microelectronics and DesignWare USB IP
Case Study: Sunplus IT and DesignWare USB 3.0 IP
Case Study: Guangdong Nufront CSC CO., LTD and DesignWare USB IP
Case Study: Hisense and DesignWare USB IP
Parrot Achieves First-Pass Silicon Success with Synopsys DesignWare Audio Analog Codec and USB 2.0 IP
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