| Enabling 3D-IC Integration | Hear how Xilinx is using SSI technology to deliver higher levels of integration and flexibility in FPGA products, and learn how Synopsys' silicon-proven tools are enabling 3D-IC integration. Steve Smith, Senior Director, 3D-IC Strategy and Marketing, Synopsys; Shankar Lakka, Director of IC Design, Full-Chip FPGA Integration Group, Xilinx Jul 18, 2012 |
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